The new head of Intel, Pat Gelsinger, began to overhaul the company and, in particular, to increase the production capabilities of enterprises. TechRadar reports that Intel is investing $3.5 billion as part of its Integrated Device Manufacturing (IDM) strategy to modernize the company’s oldest facility in Rio Rancho, New Mexico.
The investments will make it possible to create additional production facilities at the enterprise not only for the types of semiconductors already produced but also for the development of advanced technologies. In particular, at the Rio Rancho plant, Intel plans to deploy a 3D conductor packaging technology called Foveros. Recall that the Intel Ponte Vecchio graphics accelerator is built on the basis of Foveros technology. Gelsinger also expressed a desire to help other companies with a semiconductor component shortage by increasing production at Intel’s existing factories.
Among other things, the modernization of the enterprise will create at least 700 jobs in the field of high technologies, as well as about 1000 jobs that will appear during the construction of new production lines. In total, Intel’s plant provides about 3,500 jobs in New Mexico.
